Shanghai Hejian Unveils Next-Gen EDA Intelligent Agents and 3D Design Tools

Shanghai Hejian Industrial Software Group (Hejian Gongruan) has launched its next-generation EDA product portfolio, marking a significant step for China's electronic design automation industry. The suite includes the country's first EDA intelligent agent kit dedicated to the full digital chip verification process, as well as a pioneering 3D chip physical design tool and a convergence tool for advanced process nodes. These products address critical gaps in domestic commercial-grade 3DIC (three-dimensional integrated circuit) physical design and EDA agents.

The EDA intelligent agent suite is designed to streamline digital chip verification, a traditionally labor-intensive and error-prone phase. By leveraging AI-driven automation, it aims to reduce verification time and improve accuracy. The 3D chip physical design tool enables engineers to handle complex stacked-chip architectures, a key requirement for modern high-performance computing and memory integration. Additionally, the convergence tool targets advanced technology nodes, helping designers achieve faster timing closure and better yield.

Hejian Gongruan stated that its new offerings break away from the conventional model of piling up separate EDA tools with patch-based extensions. Instead, they provide an integrated, intelligent solution that enhances productivity across the chip design flow. This release underscores China's growing capabilities in semiconductor design tools, potentially reducing reliance on foreign EDA vendors in critical sectors.